The Mydata MY500 Jetprinter is the first soldering paste printer in the world to operate without stencils. The revolutionary Jetprinter technology applies the soldering paste to the circuit board using the inkjet principle. The machine deposits up to 500 droplets of soldering paste per second on the pads of the circuit board, with exact volume and precision.
- Process safety and cost reduction
This technology significantly improves one of the processes in SMT technology which determines the quality, namely the application of soldering paste. The "on-the-spot" jet printing technology allows pad diameters of 0.3 mm to be printed without problems and significantly improves process security compared to stencil printing. In addition, the lower paste consumption and the lack of a stencil means that significant cost savings are achieved. - Greater freedom in circuit board design for future technologies
Flexible programming options enable the paste volume on the pads to be adapted to meet individual requirements. Very small deposits can be positions close to large ones (e.g. 0201 components adjacent to connectors).This is a ground-breaking development in view of the trend towards finer and finer structures and the resulting limitations when there is a broad mix of components in the layout design. - Environmentally friendly technology
Paste consumption is significantly reduced and there is no need for cleaning of the stencil.